Diphenyl Diphenyl
Structural formula
Business number | 024T |
---|---|
Molecular formula | C12H10 |
Molecular weight | 154.21 |
label |
phenylbenzene, biphenyl, 1,1′-biphenyl, Bibenzene,Biphenyl, Phenylbenzene, fungicides, aromatic compounds |
Numbering system
CAS number:92-52-4
MDL number:MFCD00003054
EINECS number:202-163-5
RTECS number:DU8050000
BRN number:1634058
PubChem number:24861956
Physical property data
1. Characteristics: White to light yellow flaky crystals, with a sharp odor and a rose-like aroma after dilution.
2. Boiling point (ºC, 101.3kPa): 255.2
3. Melting point (ºC): 69
4. Relative density (g/mL, 20 /4ºC): 1.04
5. Refractive index (n77D): 1.588
6. Kinematic viscosity (m2/s, 100ºC): 0.98×10-6
7. Flash point (ºC, closed): 113
8. Ignition point (ºC): 540
9. Heat of evaporation (KJ/kg, 200ºC): 343.3
10. Heat of fusion (KJ/ mol, 70.5ºC): 18.59
11. Heat of formation (KJ/mol, solid): 96.67
12. Heat of combustion (KJ/mol): 6252.4
13. Specific heat capacity (KJ/(kg·K), constant pressure): 1.61
14. Critical temperature (ºC): 515.7
15. Critical pressure (MPa): 3.38
16. Thermal conductivity (W/(m·K), 100ºC): 1339.77
17. Lower explosion limit (%, V/V): 0.6
18. Explosion upper limit (%, V/V): 5.8
19. Solubility: Insoluble in water, soluble in ether, ethanol, carbon tetrachloride, dioxane, aromatic hydrocarbons, etc. . Dissolves 9.1% in ethanol at 19.5°C.
20. Critical pressure (MPa): 3.38
21. Critical density (g·cm-3): 0.310
22. Critical volume (cm3·mol-1): 497
23. Critical compression factor: 0.262
24 . Eccentricity factor: 0.366
25. Solubility parameter (J·cm-3)0.5: 19.383
26. van der Waals area (cm2·mol-1): 1.066×1010
27. van der Waals Volume (cm3·mol-1): 91.680
28. Gas phase standard heat of combustion (enthalpy) (kJ·mol-1 ):-6332.7
29. Gas phaseAgent, heat transfer agent, fruit antifungal agent, organic synthesis.
2. Biphenyl has high thermal stability and low vapor pressure. It has long been used as a heat transfer medium alone or mixed with diphenyl ether. Santos wax composed of biphenyl, terphenyl, etc. (containing 13% biphenyl and 61% terphenyl) can effectively absorb radiation and can be used as a heat carrier in nuclear power plants. Terphenyl ([91-94-4]) happens to be a by-product of the thermal decomposition of benzene to produce biphenyl. Depending on the reaction conditions, the ratio of biphenyl and terphenyl in the reaction product changes within a certain range. Under normal circumstances , biphenyl:terphenyl=7-8:1. Biphenyl is also used as a dyeing carrier, and its derivatives ethylbiphenyl, diethylbiphenyl, and triethylbiphenyl can be used as advanced solvents for dye solvents in pressure-sensitive copy paper. Para-phenylphenol derived from biphenyl is also mainly used to make resins. It is used as a microcapsule material for developer and coupler in the production of pressure-sensitive copy paper, and can also be used to make special coatings. Biphenyl is used as an impregnating agent for citrus wrappers and as a treatment for certain diseases of citrus plants. Chlorinated biphenyl is a plasticizer for chlorinated rubber and vinyl polymers.
3.Used in the preparation of pressure-sensitive copy paper, special coatings and other organic synthesis. Used as heat transfer agent. Chromatographic analysis reference substances and fruit fungicides.
4. A small amount is used in daily flavors and food flavors, often used as heat exchange agents and intermediates in organic synthesis.
5. This product is a better organic heat carrier and a raw material for making high-quality insulating liquids; it is used as a plasticizer and preservative, and is also used in the manufacture of dyes, engineering plastics, high-energy fuels, and anti-corrosive materials. 4-Phenylbenzophenone, the intermediate of fungal medicine, etc.